C&T Solution RCO-6000-RPL

Specifications

System


Processor
Support 12/13th/14th(Non-vPRO) Gen Intel® ADL & RPL Processor (LGA 1700, 65W/35W TDP)
• Intel® Core™ i9-14900/i9-13900E/i9-12900E, up to 24 Cores, 36MB Cache, up to 5.8 GHz, 65W
• Intel® Core™ i9-14900T/i9-13900TE/i9-12900TE, up to 24 Cores, 36MB Cache, up to 5.5 GHz, 35W
• Intel® Core™ i7-14700, up to 20 Cores, 33MB Cache, up to 5.4 GHz, 65W
• Intel® Core™ i7-14700T, up to 20 Cores, 33MB Cache, up to 5.2 GHz, 35W
• Intel® Core™ i7-13700E/i7-12700E, up to 16 Core, 30MB Cache, up to 5.1 GHz, 65W
• Intel® Core™ i7-13700TE/i7-12700TE, up to 16 Cores, 30MB cache, up to 4.8 GHz, 35W
• Intel® Core™ i5-14500/i5-13500E/i5-12500E, up to 14 Cores, 24MB Cache, up to 5.0 GHz, 65 W
• Intel® Core™ i5-14500T/i5-13500TE/i5-12500TE, up to 14 Core, 24MB Cache, up to 4.8 GHz, 35W
• Intel® Core™ i3-13100E/i3-12100E, up to 8 Cores, 12MB cache, up to 4.4 GHz, 60W
• Intel® Core™ i3-14100T/i3-13100TE/i3-12100TE, up to 4 Cores, 12MB Cache, up to 4.4 GHz, 35W
• Intel® Core™ 300T, up to 2 Cores, 6MB Cache, up to 3.4 GHz, 35W
• Intel® Pentium® G7400E,2 Cores, 6MB Cache, 3.6 GHz, 46W
• Intel® Pentium® G7400TE, 2 Cores, 6MB Cache, 3.0 GHz, 35W
• Intel® Celeron® G6900E, 2 Cores, 4MB Cache, 3.0 GHz, 46W
• Intel® Celeron® G6900TE, 2 Cores, 4MB Cache, 2.4 GHz, 35W


System Chipset
Intel® R680E Express Chipset

LAN Chipset
2.5 GbE1: Intel I226, 2.5 GbE2: Intel I226
Support Wake-on-LAN and PXE, Support TSN

Audio Codec
Realtek ALC888S

System Memory
2x 262-Pin DDR5 4800/5600MHz SODIMM.
Max. up to 64GB (ECC and Non-ECC)

Graphics
Intel® UHD Graphics 770/710

BIOS
AMI 256Mbit SPI BIOS

Watchdog
Software Programmable Supports 1~255 sec. System Reset

TPM
TPM 2.0



Display


Display Port
2x DisplayPort, Support resolution 5120 x 3200, Up to 7680 x 4320

DVI
1x DVI-I, support resolution 1920 x 1200

Multiple Display
Triple Display

VGA
Yes (by optional split cable)



Storage


M.2
1x M.2 B Key, 2242/3042/3052
(PCIe x2, Support AI Module/NVMe Storage)
(PCIe x1 & USB 3.2 Gen1, Support 4G/5G)

mSATA
1x mSATA (Shared by 1x Mini PCI Express)

SIM Socket
2x External SIM socket (Mini PCIE/M.2 B Key attached)

SSD/HDD
1x 9mm 2.5" SATA HDD Bay (Internal)
1x 7mm 2.5" SATA HDD Bay (Hot-swappable)
Support RAID 0, 1



Expansion


M.2
1x M.2 (E Key, PCIe x1, USB 2.0, 2230)

Mini PCIe
1x Full-size Mini PCIe (1x shared by 1x mSATA)

Expansion Modules
2x EDGEBoost I/O Brackets:
• 4-port GbE module with Intel® I350 Chipset, RJ-45/M12 connector (PoE optional)
• 2-Port RJ45 10GbE with Intel X710 Chipset
• 4-Port USB 3.0 (share PCIe Gen2 x1 bandwidth)
• 1x M.2 B-Key, 2242 for AI/NVMe, 1x M.2 B-Key, 3042/3052 for 5G/AI/NVMe
• 1x M.2 M-Key, PCIe x4 Lane, 2242/2260 for AI Module/NVMe
• 1x M.2 for 5G (B Key, PCIe x1, USB 3.0, 3042/3052), 2x SIM socket, 1x SIM switch



Operating System


Windows
Windows 10/11

Linux
Linux kernel



I/O


Audio
1x Mic-in, 1x Line-out

CAN
2x CAN 2.0 A/B 2-pin Internal header

COM
2x RS-232/422/485 ; 4x RS-232/422/485 (Internal)

DIO
8 in / 8 out (Isolated)

LAN
2x RJ45

EDGEBoost I/O Bracket
2x EDGEBoost I/O Bracket (By mini PCIe interface)

USB
8x USB 3.2 Gen 2 (10 Gbps)
1x USB 3.2 Gen 1 (5 Gbps, 1x Internal),
2x USB 2.0 (Internal)

Others
5x WiFi Antenna Holes
1x Power Switch, 1x AT/ATX Switch,
1x Remote Power On/Off
1x PC/Car Mode Switch, 1x Delay Time Switch
1x Removable CMOS Battery



Power


Power Adapter
Optional AC/DC 24V/9.2A, 220W
Optional AC/DC 24V/15A, 360W (i7/i9 CPU)

Power Mode
AT, ATX

Power Ignition Sensing
Power Ignition Management

Power Supply Voltage
9~48VDC

Power Connector
5-pin Terminal Block

Power Protection
OVP (Over Voltage Protection);
OCP (Over Current Protection)
Reverse Protection



Environment


Operating Temperature
-25°C to 70°C (35W CPU)
-25°C to 60°C (65W CPU)
(Optional External Fan Kit: Recommended for i9 CPU/65W)

Storage Temperature
-30°C to 85°C

Relative Humidity
10% to 95% (non-condensing)

Certification
UL 62368 Ed. 3, CE, FCC Class A

Vibration
IEC60068-2-64:2008
With HDD: 1 Grms (5 - 500 Hz, 0.5 hr/axis)
With SSD: 5 Grms (5 - 500 Hz, 0.5 hr/axis)
Designed to comply with MIL-STD-810G Method 514.7
Procedure I

Shock
IEC60068-2-27:2008
With SSD: 50G half-sin 11ms
Designed to comply with MIL-STD-810G Method 516.7
Procedure I



Physical


Construction
240 (W) x 261 (D) x 79 (H) mm

Weights
4.5 kg

Construction
Extruded Aluminum with Heavy Duty Metal

Mounting Options
Wall Mounting




• For 12/13/14th CPUs configured to run at 65W, operating temperatures will be limited to 60°C.
• 65W CPUS may experience thermal throttling depending on extreme application workloads;
  this is also due to an increase in the physical CPU cores from the Intel silicon (up to 24 cores).
  Please note, this does not indicate system malfunction or problems in the fanless design.
  Please consult our embedded engineers for the best configuration to match your application requirements.
• All product specifications and information are subject without notice.

Order Information

• C&T Solution RCO-6000-RPL Datasheet (335.3 kB)